Solid-state imaging device, manufacturing method thereof, and electronic apparatus

ABSTRACT

A solid-state imaging device includes: a plurality of photoelectric conversion units disposed on an imaging surface of a substrate; and a plurality of inner-layer lenses that are disposed in correspondence with each of the plurality of photoelectric conversion units on the upper side of the photoelectric conversion units and are formed in shapes protruding in directions toward the photoelectric conversion units, wherein each of the plurality of inner-layer lenses is formed to have different lens shapes in the center and in the periphery of the imaging surface.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. application Ser. No.12/660,211, filed on Feb. 23, 2010, which claims priority from JapanesePatent Application No. 2009-050771, filed on Mar. 4, 2009 in theJapanese Patent Office, the disclosures of which are hereby incorporatedby reference herein.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a solid-state imaging device, amanufacturing method thereof, and an electronic apparatus, and moreparticularly, to a solid-state imaging device in which a plurality ofphotoelectric conversion units are disposed on an imaging surface of asubstrate, and a plurality of inner-layer lenses are formed in shapesprotruding in directions toward the photoelectric conversion units, amanufacturing method thereof, and an electronic apparatus.

2. Description of the Related Art

Electronic apparatuses such as a digital video camera and a digitalcamera include solid-state imaging devices. For example, the solid-stateimaging device includes a CMOS (Complementary Metal OxideSemiconductor)-type image sensor and a CCD (Charge Coupled Device)-typeimage sensor.

In the solid-state imaging devices, an image forming area in which aplurality of pixels are formed is disposed on a surface of asemiconductor substrate. In each of the plurality of pixels, aphotoelectric conversion unit that generates signal electric charges byreceiving incident light through a curved lens and performingphotoelectric conversion for the received light is disposed. Forexample, a photo diode is formed as the photoelectric conversion unit.

In the solid-state imaging device, for example, an on-chip lens isdisposed on the upper side of the photoelectric conversion unit. Aconfiguration in which an inner-layer lens is disposed between thephotoelectric conversion unit and the on-chip lens has been proposed.The inner-layer lens is disposed for efficiently irradiating light thatis incident through the on-chip lens onto the photoelectric conversionunit. For example, each of a plurality of inner-layer lenses are formedto have a downward convex structure protruding in directions toward thephotoelectric conversion unit (for example, see JP-A-2002-359363 andJP-A-2007-324481).

SUMMARY OF THE INVENTION

In the solid-state imaging devices, the image quality of an image thatis imaged may deteriorate due to angles of main light beams, which arereceived by pixels, differing in accordance with the position in theimage forming area.

In particular, in a center portion of the image forming area, the angleof the main light beam incident through the curved lens is almostperpendicular to the image forming area. On the other hand, in theperipheral portion of the image forming area, the angle of the mainlight beam that is incident through the curved lens is tilted withrespect to the direction perpendicular to the image forming area.Accordingly, there are cases where the center portion of the image thatis imaged becomes a bright image, and a peripheral portion becomes adark image, thereby deteriorating the image quality of the image that isimaged.

In other words, there is a difference between the sensitivities of thecenter portion and the peripheral portion of the image forming area, andaccordingly, there are cases where the image quality of an image that isimaged deteriorates.

Accordingly, there is a need for providing a solid-state imaging devicecapable of improving the image quality of an image that is imaged, amanufacturing method thereof, and an electronic apparatus.

According to an embodiment of the present invention, there is provided asolid-state imaging device including: a plurality of photoelectricconversion units disposed on an imaging surface of a substrate; and aplurality of inner-layer lenses that are disposed in correspondence witheach of the plurality of photoelectric conversion units on the upperside of the photoelectric conversion units and are formed in shapesprotruding in directions toward the photoelectric conversion units. Eachof the plurality of inner-layer lenses is formed to have different lensshapes in the center and the periphery of the imaging surface.

According to another embodiment of the present invention, there isprovided an electronic apparatus including: a plurality of photoelectricconversion units disposed on an imaging surface of a substrate; and aplurality of inner-layer lenses that are disposed in correspondence witheach of the plurality of photoelectric conversion units on the upperside of the photoelectric conversion units and are formed in shapesprotruding in directions toward the photoelectric conversion units. Eachof the plurality of inner-layer lenses is formed to have different lensshapes in the center and the periphery of the imaging surface.

According to another embodiment of the present invention, there isprovided a method of manufacturing a solid-state imaging device. Themethod includes forming a plurality of inner-layer lenses in shapesprotruding in directions toward a plurality of photoelectric conversionunits on the upper side of the plurality of photoelectric conversionunits so as to be in correspondence with each of the plurality ofphotoelectric conversion units disposed on an imaging surface of asubstrate. In the forming of the plurality of inner-layer lenses, eachof the plurality of inner-layer lenses is formed to have different lensshapes in the center and the periphery of the imaging surface.

According to an embodiment of the present invention, as described above,by forming the lens shape of each of the plurality of inner-layer lensesto be different in the center and in the periphery of the imagingsurface, occurrence of a difference between the sensitivities of thecenter portion and the peripheral portion of the image forming area isprevented.

According to an embodiment of the present invention, a solid-stateimaging device capable of improving the image quality of an image thatis imaged, a manufacturing method thereof, and an electronic apparatuscan be provided.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a configuration diagram showing the configuration of a camera40 according to Embodiment 1 of the present invention.

FIG. 2 is a schematic plan view showing the entire configuration of asolid-state imaging device according to Embodiment 1 of the presentinvention.

FIG. 3 is a circuit diagram showing a major portion of a pixel P, whichis disposed in an image forming area PA, according to Embodiment 1 ofthe present invention.

FIG. 4 is a cross-sectional view representing a major portion of asolid-state imaging device 1 according to Embodiment 1 of the presentinvention.

FIG. 5 is a cross-sectional view representing a major portion of asolid-state imaging device 1 according to Embodiment 1 of the presentinvention.

FIG. 6 is a plan view showing the relationship between lens materiallayers configuring an inner-layer lens 120 and a photo diode 21,according to Embodiment 1 of the present invention.

FIG. 7 is a plan view showing the relationship between lens materiallayers configuring an inner-layer lens 120 and a photo diode 21,according to Embodiment 1 of the present invention.

FIGS. 8A and 8B are cross-sectional views representing major portionsdisposed in each process of a method of manufacturing a solid-stateimaging device 1 according to Embodiment 1 of the present invention.

FIGS. 9A and 9B are cross-sectional views representing major portionsdisposed in each process of a method of manufacturing a solid-stateimaging device 1 according to Embodiment 1 of the present invention.

FIGS. 10A and 10B are cross-sectional views representing major portionsdisposed in each process of a method of manufacturing a solid-stateimaging device 1 according to Embodiment 1 of the present invention.

FIG. 11 is a diagram showing the appearance of a main light beamincident to a solid-state imaging device 1 according to Embodiment 1 ofthe present invention.

FIG. 12 is a diagram showing the appearance of a main light beamincident to a solid-state imaging device 1 according to Embodiment 1 ofthe present invention.

FIG. 13 is a cross-sectional view representing a major portion of asolid-state imaging device 1 b according to Embodiment 2 of the presentinvention.

FIG. 14 is a cross-sectional view representing a major portion of asolid-state imaging device 1 b according to Embodiment 2 of the presentinvention.

FIG. 15 is a cross-sectional view representing a major portion of asolid-state imaging device 1 c according to Embodiment 3 of the presentinvention.

FIG. 16 is a cross-sectional view representing a major portion of asolid-state imaging device 1 c according to Embodiment 3 of the presentinvention.

FIG. 17 is a cross-sectional view representing a major portion of asolid-state imaging device 1 d according to Embodiment 4 of the presentinvention.

FIG. 18 is a cross-sectional view representing a major portion of asolid-state imaging device 1 d according to Embodiment 4 of the presentinvention.

FIG. 19 is a cross-sectional view representing a major portion of asolid-state imaging device 1 e according to Embodiment 5 of the presentinvention.

FIG. 20 is a cross-sectional view representing a major portion of asolid-state imaging device 1 e according to Embodiment 5 of the presentinvention.

FIG. 21 is a diagram showing a major portion of a solid-state imagingdevice according to an embodiment of the present invention.

FIG. 22 is a diagram showing a major portion of a solid-state imagingdevice according to an embodiment of the present invention.

FIG. 23 is a diagram showing a major portion of a solid-state imagingdevice according to an embodiment of the present invention.

FIG. 24 is a diagram showing a major portion of a solid-state imagingdevice according to an embodiment of the present invention.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, embodiments of the present invention will be described withreference to the accompanying drawings.

Description will be made in the following order.

1. Embodiment 1

2. Embodiment 2 (a case where an inner-layer lens has a taper shape)

3. Embodiment 3 (a case where the refractive index of an inner-layerlens decreases toward photo diode)

4. Embodiment 4 (a case where the refractive index of an inner-layerlens increases toward photo diode)

5. Embodiment 5 (a case where an optical waveguide is included)

6. Others

1. Embodiment 1 [Device Configuration] (1) Configuration of MajorPortion of Camera

FIG. 1 is a configuration diagram showing the configuration of a camera40 according to Embodiment 1 of the present invention.

As shown in FIG. 1, the camera 40 includes a solid-state imaging device1, a curved lens 42, a driving circuit 43, and a signal processingcircuit 44. Each component will be sequentially described.

The solid-state imaging device 1 generates signal electric charges byreceiving light (subject image) incident to an imaging surface PSthrough the curved lens 42 and performs photoelectric conversion for thereceived light. Here, the solid-state imaging device 1 is driven inaccordance with a driving signal that is output from the driving circuit43. In particular, the solid-state imaging device 1 reads out the signalelectric charges and outputs raw data.

In this embodiment, as shown in FIG. 1, a main light beam H1 that isoutput from the curved lens 42 is incident to the center portion of theimaging surface PS at an angle to be perpendicular to the imagingsurface PS of the solid-state imaging device 1. On the other hand, amain light beam H2 is incident to the peripheral portion of the imagingsurface PS at an angle to be tilted with respect to the directionperpendicular to the imaging surface PS of the solid-state imagingdevice 1.

The curved lens 42 is arranged so as to collect incident light Hcorresponding to a subject image on the imaging surface PS of thesolid-state imaging device 1.

In this embodiment, the curved lens 42 is disposed such that the opticalaxis thereof is in correspondence with the center of the imaging surfacePS of the solid-state imaging device 1. Accordingly, the curved lens 42,as represented in FIG. 1, emits the main light beam H1 to the centerportion of the imaging surface PS of the solid-state imaging device 1 atan angle to be perpendicular to the imaging surface PS. On the otherhand, in the peripheral portion of the imaging surface PS, the curvedlens 42 emits the main light beam H2 at an angle to be tilted withrespect to the direction perpendicular to the imaging surface PS.

The driving circuit 43 outputs various driving signals to thesolid-state imaging device 1 and the signal processing circuit 44 so asto drive the solid-state imaging device 1 and the signal processingcircuit 44.

The signal processing circuit 44 is configured so as to generate adigital image for a subject image by performing a signal process for theraw data that is output from the solid-state imaging device 1.

(2) Configuration of Major Portion of Solid-State Imaging Device

The entire configuration of the solid-state imaging device 1 will bedescribed.

FIG. 2 is a schematic plan view showing the entire configuration of thesolid-state imaging device 1 according to Embodiment 1 of the presentinvention.

The solid-state imaging device 1 according to this embodiment is aCMOS-type image sensor and includes a substrate 101 as shown in FIG. 2.This substrate 101, for example, is a semiconductor substrate that isformed from silicon. As shown in FIG. 2, an image forming area PA and aperipheral area SA are disposed on the surface of the substrate 101.

The image forming area PA, as represented in FIG. 2, has a rectangularshape, and a plurality of pixels P are disposed therein in thedirections of x and y. In other words, pixels P are aligned in a matrixshape. In addition, the image forming area PA is disposed such that thecenter thereof is in correspondence with the optical axis of the curvedlens 42 shown in FIG. 1.

This image forming area PA corresponds to the imaging surface shown inFIG. 1. Accordingly, as described above, the main light beam (H1represented in FIG. 1) is incident to pixels P that are disposed in thecenter portion of the image forming area PA at an angle to beperpendicular to the surface of the image forming area PA. On the otherhand, the main light beam (H2 represented in FIG. 1) is incident topixels P that are disposed in the peripheral portion of the imageforming area PA at an angle to be tilted with respect to the directionperpendicular to the surface of the image forming area PA.

The peripheral area SA, as shown in FIG. 2, is disposed on the peripheryof the image forming area PA. In the peripheral area SA, peripheralcircuits that process the signal electric charges generated for thepixels P are disposed.

In particular, as shown in FIG. 2, as the peripheral circuits, avertical selection circuit 13, a column circuit 14, a horizontalselection circuit 15, a horizontal signal line 16, an output circuit 17,and a timing generator (TG) 18 are disposed.

The vertical selection circuit 13, for example, includes a shiftregister and selects the pixels P so as to be driven in units of a row.

The column circuit 14, for example, includes an S/H (sample and hold)circuit and a CDS (Correlated Double Sampling) circuit. The columncircuit 14 performs signal processing for signals read out from thepixels P in units of a column.

The horizontal selection circuit 15, for example, includes a shiftregister and sequentially selects the signals read out from the pixels Pby the column circuit 14 so as to be output. Then, in accordance withthe selective driving performed by the horizontal selection circuit 15,the signals read out from the pixels P are sequentially output to theoutput circuit 17 through the horizontal signal line 16.

The output circuit 17, for example, includes a digital amplifier,performs signal processing such as an amplification process for thesignals output from the horizontal selection circuit 15, and thenoutputs the signals externally.

The timing generator 18 generates various timing signals and outputs thetiming signals to the vertical selection circuit 13, the column circuit14, and the horizontal selection circuit 15, thereby performing drivingcontrol for each unit.

(3) Configuration of Major Portion of Pixel

FIG. 3 is a circuit diagram showing a major portion of the pixel P,which is disposed in the image forming area PA, according to Embodiment1 of the present invention.

The pixel P disposed in the image forming area PA, as shown in FIG. 3,includes a photo diode 21, a transmission transistor 22, an amplifiertransistor 23, an address transistor 24, and a reset transistor 25. Inother words, a photo diode 21 and a pixel transistor that reads signalelectric charges from the photo diode 21 are disposed.

In the pixel P, the photo diode 21 receives light corresponding to asubject image and performs photoelectric conversion for the receivedlight, thereby generating and accumulating signal electric charges. Thephoto diode 21, as shown in FIG. 3, is connected to the gate of theamplifier transistor 23 through the transmission transistor 22. Inaddition, the signal electric charges accumulated in the photo diode 21are transmitted to a floating diffusion FD, which is connected to thegate of the amplifier transistor 23, by the transmission transistor 22as an output signal.

In the pixel P, the transmission transistor 22, as shown in FIG. 3, isdisposed so as to be interposed between the photo diode 21 and thefloating diffusion FD. The transmission transistor 22 transmits thesignal electric charges accumulated in the photo diode 21 to thefloating diffusion FD as an output signal in accordance with applicationof a transmission pulse from the transmission line 26 to the gate of thetransmission transistor 22.

In the pixel P, the amplifier transistor 23, as shown in FIG. 3, has thegate connected to the floating diffusion FD and amplifies an outputsignal that is output through the floating diffusion FD. Here, theamplifier transistor 23 is connected to the vertical signal line 27through the address transistor 24 and configures a source followertogether with a static current source I that is disposed in an areaother than the image forming area PA. The amplifier transistor 23amplifies an output signal output from the floating diffusion FD inaccordance with supply of an address signal to the address transistor24.

In the pixel P, the address transistor 24, as shown in FIG. 3, has thegate connected to the address line 28 to which the address signal issupplied. When being supplied with the address signal, the addresstransistor 24 is in the ON state and outputs the output signal amplifiedby the amplifier transistor 23 as described above to the vertical signalline 27. Then, the output signal is output to the S/H circuit and theCDS circuit of the above-described column circuit 14 through thevertical signal line 27.

In the pixel P, the reset transistor 25, as shown in FIG. 3, has thegate connected to the reset line 29 to which a reset signal is suppliedand is connected so as to be interposed between the power source Vdd andthe floating diffusion FD. When a reset signal is supplied to the gateof the reset transistor 25 from the reset line 29, the reset transistor25 resets the electric potential of the floating diffusion FD to theelectric potential of the power source Vdd.

The gates of the transistors 22, 24, and 25 are connected in units of arow that is configured by a plurality of pixels aligned in thehorizontal direction x. Thus, the above-described operation for drivingthe pixel is simultaneously performed for a plurality of pixels alignedin the unit of a row. In particular, the pixels are sequentiallyselected in the vertical direction in units of a horizontal line (pixelrow) in accordance with the address signal that is supplied by theabove-described vertical selection circuit 13. Then, the transistor ofeach pixel is controlled in accordance with various timing signalsoutput from the timing generator 18. Accordingly, the output signals ofeach pixel are read out by the S/H circuits and the CDS circuits of thecolumn circuits 14 of each pixel column through the vertical signal line27.

(4) Detailed Configuration of Solid-State Imaging Device

The solid-state imaging device 1 according to this embodiment will bedescribed in detail.

FIG. 4 and FIG. 5 are cross-sectional views representing major portionsof the solid-state imaging device 1 according to Embodiment 1 of thepresent invention. Here, FIG. 4 shows a cross-section of the pixel Pdisposed in the center portion of the image forming area PA representedin FIG. 2. On the other hand, FIG. 5 shows a cross-section of the pixelP disposed in the peripheral portion of the image forming area PArepresented in FIG. 2. FIG. 5 shows a case where the right side is thecenter side of the image forming area PA, and the left side is theperipheral side of the image forming area PA.

In the image forming area PA, the pixel P is configured as representedin FIG. 3. However, members other than the photo diode 21, whichconfigure the pixel P, are not shown in the figures.

As shown in FIGS. 4 and 5, in the solid-state imaging device 1, a photodiode 21, an inner-layer lens 120, a color filter 130, and an on-chiplens 140 are formed in correspondence with a pixel P. In addition, here,as shown in FIGS. 4 and 5, the inner-layer lens 120 is configured by afirst inner-layer lens material layer 121, a second inner-layer lensmaterial layer 122, and a third inner-layer lens material layer 123.

Each portion will be sequentially described.

The photo diode 21, as shown in FIGS. 4 and 5, is disposed on thesurface of the substrate 101. The photo diode 21 generates signalelectric charges by receiving light on a light reception surface JS andperforming photoelectric conversion for the received light. A pluralityof the photo diodes 21 are disposed on the surface of the substrate 101in correspondence with a plurality of the pixels P shown in FIG. 2.

In addition, on the upper side of the photo diode 21, a wiring layer 110is disposed. In the wiring layer 110, wirings 110 h electricallyconnected to each element are formed inside an insulating layer 110 z.The insulating layer 110 z is formed from a light-transmissive materialthrough which light can be transmitted. For example, the insulatinglayer 110 z is formed from a silicon oxide film (refractive indexn=1.43). In addition, the wiring 110 h is formed from a conductivematerial such as a metal.

Additionally, on the upper side of the photo diode 21, as shown in FIGS.4 and 5, the inner-layer lens 120, the color filter 130, and the on-chiplens 140 are disposed. Here, from the side of the light receptionsurface JS, the inner-layer lens 120, the color filter 130, and theon-chip lens 140 are sequentially disposed.

In this embodiment, as can be noticed by comparing FIGS. 4 and 5 witheach other, the positions of the portions 120, 130, and 140 with respectto the photo diode 21 differ in correspondence with the position of thepixel P. Here, the center positions of the portions 120, 130, and 140are disposed so as to be shifted further to the center side of the imageforming area PA with respect to the center of the light receptionsurface JS of the photo diode 21 as the position of the pixel P disposedon the image forming area PA is more distant from the center side of theimage forming area PA.

In particular, as shown in FIG. 4, in the pixel P disposed in the centerportion of the image forming area PA, the center positions of theportions 120, 130, and 140 coincide with the center axis C of the lightreception surface JS on the upper side of the light reception surfaceJS.

On the other hand, as shown in FIG. 5, in the pixel P disposed in theperipheral portion of the image forming area PA, the center positions ofthe portions 120, 130, and 140 do not coincide with the center axis C ofthe light reception surface JS but are shifted to one side along the xyplane, on the upper side of the light reception surface JS. FIG. 5, asdescribed above, shows a case where the right side is the center side ofthe image forming area PA, and the left side is the peripheral side ofthe image forming area PA. Accordingly, the center positions of theportions 120, 130, and 140 are disposed so as to be shifted to the rightside with respect to the center of the light reception surface JS.

Although not shown in the figure, in contrast to FIG. 5, in a case wherethe left side is the center side of the image forming area PA, and theright side is the peripheral side of the image forming area PA, thecenter positions of the portions 120, 130, and 140 are disposed so as tobe shifted to the left side with respect to the center of the lightreception surface JS. In other words, the portions 120, 130, and 140 aredisposed such that the pitches of the portions 120, 130, and 140 areless than the pitch of the photo diodes 21 disposed in the pixels P.

The inner-layer lens 120, as shown in FIGS. 4 and 5, are formed so as tobe positioned on the wiring layer 110 to the upper side of the surfaceof the substrate 101.

In this embodiment, as can be noticed by comparing FIGS. 4 and 5 witheach other, the position of the inner-layer lens 120 with respect to thephoto diode 21 differs in correspondence with the position of the pixelP. Here, the center position of the inner-layer lens 120 is disposed soas to be shifted further to the center side of the image forming area PAwith respect to the center of the light reception surface JS of thephoto diode 21 as the position of the pixel P disposed in the imageforming area PA is more distant from the center of the image formingarea PA. In other words, the inner-layer lenses 120 are disposed suchthat the pitch of the inner-layer lenses 120 is less than the pitch ofthe photo diodes 21 disposed in the pixels P.

In addition, the inner-layer lens 120 is configured to collect lightoutput from the color filter 130 on the surface of the substrate 101. Inparticular, the inner-layer lens 120 is formed such that the centerportion is thicker than the edge portion in the direction toward thelight reception surface JS of the photo diode 21.

In this embodiment, the inner-layer lens 120, as shown in FIGS. 4 and 5,is formed such that the area of the face along the light receptionsurface JS of the photo diode 21 sequentially decreases in a steppedmanner in a direction from the on-chip lens 140 side toward the photodiode 21 side.

In particular, the inner-layer lens 120 includes a first lens materiallayer 121, a second lens material layer 122, and a third lens materiallayer 123. The first to third lens material layers 121, 122, and 123 aresequentially stacked on the upper side of the light reception surface JSof the photo diode 21. In the inner-layer lens 120, side faces of thelens material layers 121, 122, and 123 are disposed in differentpositions in the direction of the xy plane such that different levelsare formed on the side face along the z direction that is perpendicularto the light reception surface JS.

The lens material layers 121, 122, and 123 are respectively formed byusing optical materials that have refractive indices higher than thoseof the interlayer insulating films 111, 112, and 113 disposed on theperiphery thereof. For example, the lens material layers 121, 122, and123 are formed by using silicon nitride (refractive index: 2.0) that isdeposited by using a plasma CVD method.

In the inner-layer lens 120, the first lens material layer 121, as shownin FIGS. 4 and 5, is disposed in a position closest to the lightreception surface JS among the plurality of the lens material layers121, 122, and 123.

In addition, in the inner-layer lens 120, the second lens material layer122, as shown in FIGS. 4 and 5, is disposed between the first lensmaterial layer 121 and the third lens material layer 123.

In addition, in the inner-layer lens 120, the third lens material layer123, as shown in FIGS. 4 and 5, is disposed in a position that is themost distant from the light reception surface JS among the plurality ofthe lens material layers 121, 122, and 123.

FIG. 6 and FIG. 7 are plan views showing the relationship between thelens material layers 121, 122, and 123 configuring the inner-layer lens120 and the photo diode 21, according to Embodiment 1 of the presentinvention. Here, FIG. 6, similarly to FIG. 4, represents a portion ofthe pixel P disposed in the center portion of the image forming area PArepresented in FIG. 2. On the other hand, FIG. 7, similarly to FIG. 5,represents a portion of the pixel P disposed in the peripheral portionof the image forming area PA represented in FIG. 2. In FIGS. 6 and 7,for convenience of illustration, the lens material layers 121, 122, and123 configuring the inner-layer lens 120 are represented, and the photodiode 21 is denoted by a dotted line.

As shown in FIGS. 6 and 7, the planar shapes of the first to third lensmaterial layers 121, 122, and 123 are rectangles and are formed to besimilar to one another. In other words, the lens material layers 121,122, and 123 are formed to have the same pattern but to have differentareas. Here, the first lens material 121 is formed to have an arealarger than that of the second lens material 122. In addition, thesecond lens material layer 122 is formed to have an area larger thanthat of the third lens material layer 123.

In other words, the plurality of the lens material layers 121, 122, and123 are formed such that the lower face of the first lens material layer121, which is the closest to the photo diode 21, has an area smallerthan that of the upper face of the third lens material layer 123, whichis the most distant from the photo diode 21.

In particular, as shown in FIG. 6, in the pixel P disposed in the centerportion of the image forming area PA, the center position of each of thelens material layers 121, 122, and 123 is disposed so as to coincidewith the center C of the light reception surface JS of the photo diode21.

On the other hand, as shown in FIG. 7, in the pixel P disposed in theperipheral portion of the image forming area PA, the center positions ofthe lens material layers 121, 122, and 123 do not coincide with thecenter C of the light reception surface JS of the photo diode 21 and areshifted to one side along the xy plane. FIG. 7, similarly to FIG. 5,shows a case where the right side is the center side of the imageforming area PA, and the left side is the peripheral side of the imageforming area PA. Accordingly, in this portion, the center positions ofthe first to third lens material layers 121, 122, and 123 are disposedso as to be sequentially shifted to the right side with respect to thecenter C of the light reception surface JS of the photo diode 21.

The color filter 130, as shown in FIG. 4 and FIG. 5, is formed so as tobe positioned on the inner-layer lens 120 on the upper side of thesurface of the substrate 101. The color filter 130 is configured toallow the light corresponding to the subject image to be colored andoutputs the colored light to the surface of the substrate 101. Forexample, the color filter 130 is formed by coating with a coatingsolution containing a coloring pigment and photoresist resin by using acoating method such as a spin coating method so as to form a coatingfilm and then by patterning and processing the coating film by usinglithographic technology. Although not shown in the figure, the colorfilter 130 is disposed in each pixel P as one of a green filter layer, ared filter layer, and a blue filter layer. For example, each of thegreen filter layer, the red filter layer, and the blue filter layer isdisposed in a Bayer arrangement so as to be parallel to one another.

In this embodiment, as can be noticed by comparing FIGS. 4 and 5 witheach other, the position of the color filter 130 with respect to thephoto diode 21 differs in correspondence with the position of the pixelP. Here, the center position of the color filter 130 is disposed so asto be shifted further to the center side of the image forming area PAwith respect to the center of the light reception surface JS of thephoto diode 21 as the position of the pixel P disposed in the imageforming area PA is more distant from the center of the image formingarea PA. In other words, the color filters 130 are disposed such thatthe pitch of the color filters 130 is less than the pitch of the photodiodes 21 disposed in the pixels P. In addition, the color filters 130are disposed such that the pitch of the color filters 130 is less thanthat of the inner-layer lenses 120 disposed in the pixels P.

The on-chip lens 140, as shown in FIG. 4 and FIG. 5, is formed so as tobe positioned on the color filter 130 on the upper side of the surfaceof the substrate 101. This on-chip lens 140 is configured so as tocollect incident light onto the light reception surface JS of the photodiode 21. In particular, the on-chip lens 140 is formed such that thecenter portion is thicker than the edge portion in a direction towardthe light reception surface JS of the photo diode 21.

In this embodiment, as can be noticed by comparing FIGS. 4 and 5 witheach other, the position of the on-chip lens 140 with respect to thephoto diode 21 differs in correspondence with the position of the pixelP. Here, the center position of the on-chip lens 140 is disposed so asto be shifted further to the center side of the image forming area PAwith respect to the center of the light reception surface JS of thephoto diode 21 as the position of the pixel P disposed in the imageforming area PA is more distant from the center of the image formingarea PA. In other words, the on-chip lenses 140 are disposed such thatthe pitch of the on-chip lenses 140 is less than the pitch of the photodiodes 21 disposed in the pixels P. In addition, the on-chip lenses 140are disposed such that the pitch of the on-chip lenses 140 is less thanthat of the inner-layer lenses 120 disposed in the pixels P.

[Manufacturing Method]

Hereinafter, a major portion of a manufacturing method for manufacturingthe above-described solid-state imaging device 1 will be described. Inparticular, a process for forming the inner-layer lens 120 in thesolid-state imaging device 1 will be described in detail.

FIGS. 8A, 8B, 9A, 9B, 10A, and 10B are cross-sectional viewsrepresenting major portions disposed in each process of the method ofmanufacturing the solid-state imaging device 1 according to Embodiment 1of the present invention. FIGS. 8A, 9A, and 10A, similarly to FIG. 4,show the portion of the pixel P disposed in the center portion of theimage forming area PA represented in FIG. 2. On the other hand, FIGS.8B, 9B, and 10B, similarly to FIG. 5, show the portion of the pixel Pdisposed in the peripheral portion of the image forming area PArepresented in FIG. 2.

(1) Formation of First Lens Material Layer 121

First, as represented in FIGS. 8A and 8B, the first lens material layer121 that configures the inner-layer lens 120 is formed.

Here, as shown in FIGS. 8A and 8B, the first lens material layer 121 isformed on the wiring layer 110.

For example, the interlayer insulating film 111 is formed on the wiringlayer 110. Then, an opening is formed in an area, which forms the firstlens material layer 121, of the interlayer insulating film 111. Forexample, the interlayer insulating film 111 is formed by forming asilicon oxide film by using a CVD method. Then, for example, the openingis formed in the interlayer insulating film 111, for example, by usingphotolithographic technology.

In this embodiment, for example, by performing an anisotropic etchingprocess, this formation process is performed such that the side face ofthe opening is formed in a direction perpendicular to the surface of thesubstrate 101.

Thereafter, by forming an optical material as a film so as to bury theopening formed in the interlayer insulating film 111, the first lensmaterial layer 121 is formed. For example, after silicon nitride isdeposited by using the plasma CVD method, the surface is flattened byperforming a CMP (Chemical Mechanical Polishing) process. Accordingly,the first lens material layer 121 is formed inside the opening.

In this embodiment, as represented in FIGS. 8A and 8B, the first lensmaterial layer 121 is formed such that the position of the first lensmaterial layer 121 with respect to the photo diode 21 differs incorrespondence with the position of the pixel P in the image formingarea PA.

In particular, this formation process is performed such that the centerposition of the first lens material layer 121 is shifted further to thecenter side of the image forming area PA with respect to the center ofthe light reception surface JS of the photo diode 21 as the position ofthe pixel P disposed in the image forming area PA is more distant fromthe center of the image forming area PA. In other words, the first lensmaterial layer 121 is formed such that the pitch of the first lensmaterial layer 121 is less than the pitch of the photo diodes 21disposed in the pixels P.

(2) Formation of Second Lens Material Layer 122

Next, as represented in FIGS. 9A and 9B, the second lens material layer122 that configures the inner-layer lens 120 is formed.

Here, as represented in FIGS. 9A and 9B, the second lens material layer122 is formed on the first lens material layer 121.

For example, after the interlayer insulating film 112 is formed on thefirst lens material layer 121, an opening is formed in an area, whichforms the second lens material layer 122, of the interlayer insulatingfilm 112. Similarly to the case of the first lens material layer 121,the opening is formed in the interlayer insulating film 112.

Thereafter, similarly to the case of the first lens material layer 121,the second lens material layer 122 is formed by burying an opticalmaterial in the opening that is formed in the interlayer insulating film112.

In this embodiment, as represented in FIGS. 9A and 9B, similarly to thefirst lens material layer 121, the second lens material layer 122 isformed such that the position of the second lens material layer 122 withrespect to the photo diode 21 differs in correspondence with theposition of the pixel P in the image forming area PA.

In particular, this formation process is performed such that the centerposition of the second lens material layer 122 is shifted further to thecenter side of the image forming area PA with respect to the center ofthe light reception surface JS of the photo diode 21 as the position ofthe pixel P disposed in the image forming area PA is more distant fromthe center of the image forming area PA. Here, the second lens materiallayers 122 are formed such that the pitch of the second lens materiallayers 122 is less than the pitch of the first lens material layers 121of the pixels P.

(3) Formation of Third Lens Material Layer 123

Next, as represented in FIGS. 10A and 10B, the first lens material layer121 that configures the inner-layer lens 120 is formed.

Here, as represented in FIGS. 10A and 10B, the third lens material 123is formed on the second lens material layer 122.

For example, after the interlayer insulating film 113 is formed on thesecond lens material layer 122, an opening is formed in an area, whichforms the third lens material layer 123, of the interlayer insulatingfilm 113. Similarly to the cases of the first and second lens materiallayers 121 and 122, the opening is formed in the interlayer insulatingfilm 113.

Thereafter, similarly to the cases of the first and second lens materiallayers 121 and 122, the third lens material layer 123 is formed byburying an optical material in the opening that is formed in theinterlayer insulating film 113.

In this embodiment, as represented in FIGS. 10A and 10B, the third lensmaterial layer 123 is formed such that the position of the third lensmaterial layer 123 with respect to the photo diode 21 differs incorrespondence with the position of the pixel P in the image formingarea PA.

In particular, this formation process is performed such that the centerpositions of the second lens material layer 122 and the third lensmaterial layer 123 are shifted further to the center side of the imageforming area PA with respect to the center of the light receptionsurface JS of the photo diode 21 as the position of the pixel P disposedin the image forming area PA is more distant from the center of theimage forming area PA. Here, the third lens material layers 123 areformed such that the pitch of the third lens material layers 123 is lessthan the pitch of the second lens material layers 122 of the pixels P.

Thereafter, as shown in FIGS. 4 and 5, the color filter 130 and theon-chip lens 140 are formed, and thereby the solid-state imaging device1 is completed.

[Operation]

FIGS. 11 and 12 are diagrams showing the appearance of a main light beamincident to the solid-state imaging device 1 according to Embodiment 1of the present invention. Here, FIG. 11, similarly to FIG. 4, representsa portion of the pixel P that is disposed in the center portion of theimage forming area PA represented in FIG. 2. On the other hand, FIG. 12,similarly to FIG. 5, represents a portion of the pixel P that isdisposed in the peripheral portion of the image forming area PArepresented in FIG. 2.

As illustrated in FIG. 11, in the center portion of the image formingarea PA, the main light beam H1 is incident from the upper side of thephoto diode 21 to the light reception surface JS at an angle to beperpendicular to the light reception surface JS. Then, the main lightbeam H1 is incident to the color filter 130 through the on-chip lens 140with the angle maintained. Thereafter, as shown in FIG. 11, the mainlight beam H1 output from the color filter 130 is incident to theinner-layer lens 120.

Here, the inner-layer lens 120 forms a lens surface Lc as denoted by adashed-dotted line shown in FIG. 11. In other words, the inner-layerlens 120 is formed as a downward convex lens having the lens surface Lcsymmetrical to an axis perpendicular to the center of the lightreception surface JS. Accordingly, from the inner-layer lens 120,similarly to the case of the on-chip lens 140, the main light beam H1 isoutput at an angle perpendicular to the light reception surface JS.Then, this main light beam H1 is incident to the light reception surfaceJS of the photo diode 21 through the wiring layer 110.

On the other hand, as illustrated in FIG. 12, in the peripheral portionof the image forming area PA, the main light beam H2 is incident fromthe upper side of the photo diode 21 to the light reception surface JSat an angle tilted with respect to the direction perpendicular to thelight reception surface JS. Then, the main light beam H2 is incident tothe color filter 130 through the on-chip lens 140 with the anglemaintained. Thereafter, as illustrated in FIG. 12, the main light beamH2 output from the color filter 130 is incident to the inner-layer lens120.

Here, the inner-layer lens 120 forms a lens surface Ls as denoted by adashed-dotted line shown in FIG. 12. The inner-layer lens 120 is formedas a downward convex lens having the lens surface Ls asymmetrical to anaxis perpendicular to the center of the light reception surface JS. Inother words, a lens that is formed by shifting an upside-down bell to betilted is formed. In particular, the inner-layer leans 120, asillustrated in FIG. 12, is formed by designing the lens surface Ls so asto refract the main light beam H2, so that the main light beam H2 isclose to the center of the light reception surface JS of the photo diode21. Accordingly, the main light beam H2 output from the inner-layer lens120 is incident to the light reception surface JS of the photo diode 21through the wiring layer 110.

[Sum Up]

As described above, in this embodiment, on the upper side of a pluralityof the photo diodes 21, a plurality of the inner-layer lenses 120 areformed in a shape protruding in directions toward the photo diodes 21.Each of the plurality of the inner-layer lenses 120 is formed such thatthe shape of the lens is different in the center of the image formingarea PA and the periphery thereof. Here, each inner-layer lens 120 isdisposed such that the center of the inner-layer lens 120 is shiftedfurther to the center side of the image forming area PA with respect tothe center of the photo diode 21 as the position of the pixel disposedin the image forming area is more distant from the center.

Accordingly, as illustrated in FIGS. 11 and 12 described above, on boththe center and the periphery of the image forming area PA, the mainlight beams H1 and H2 can be optimally incident to the photo diode 21.Therefore, occurrence of a difference between the sensitivities of thecenter and the periphery of the image forming area PA can be suppressed.

As a result, according to this embodiment, the image quality of an imagethat is imaged can be improved.

In addition, in this embodiment, the inner-layer lens 120 is formed bystacking a plurality of lens material layers 121, 122, and 123.Accordingly, the entire shape of the inner-layer lens 120 can bedesigned with a high degree of freedom, and the above-describedadvantages can be acquired in an easy manner.

2. Embodiment 2 [Configuration of Device and Others]

FIG. 13 and FIG. 14 are cross-sectional views representing majorportions of the solid-state imaging device 1 b according to Embodiment 2of the present invention. Here, FIG. 13, similarly to FIG. 4, shows aportion of the pixel P disposed in the center portion of the imageforming area PA represented in FIG. 2. On the other hand, FIG. 14,similarly to FIG. 5, shows a portion of the pixel P disposed in theperipheral portion of the image forming area PA represented in FIG. 2.

As shown in FIGS. 13 and 14, in this embodiment, an inner-layer lens 120b is different from that of Embodiment 1. Except for this point, thisembodiment is the same as Embodiment 1. Thus, description of portionscommon to Embodiment 1 is omitted here.

The inner-layer lens 120 b, as shown in FIGS. 13 and 14, similarly tothat of Embodiment 1, includes first to third lens material layers 121b, 122 b, and 123 b.

The first to third lens material layers 121 b, 122 b, and 123 b,differently from Embodiment 1, are formed such that the side facesthereof are tapered faces tilted with respect to the z direction that isperpendicular to the light reception surface JS.

In particular, as shown in FIGS. 13 and 14, the side face of the firstlens material layer 121 b is formed to be tilted such that the firstlens material layer 121 b is narrowed in a tapered shape from the upperside toward the lower side.

In addition, the side face of the second lens material layer 122 b,similarly to that of the first lens material layer 121 b, as shown inFIGS. 13 and 14, is formed to be tilted such that the second lensmaterial layer 122 b is narrowed in a tapered shape from the upper sidetoward the lower side. Here, the width of the lower end portion of thesecond lens material layer 122 b is formed to be equal to or greaterthan that of the upper end portion of the first lens material layer 121b.

In addition, the side face of the third lens material layer 123 b,similarly to those of the first and second lens material layers 121 band 122 b, as shown in FIGS. 13 and 14, is formed to be tilted such thatthe third lens material layer 123 b is narrowed in a tapered shape fromthe upper side toward the lower side. Here, the width of the lower endportion of the third lens material layer 123 b is formed to be equal toor greater than that of the upper end portion of the second lensmaterial layer 122 b.

The lens material layers 121 b, 122 b, and 123 b are formed by buryinglens materials in openings formed in the interlayer insulating films111, 112, and 113. In this embodiment, each opening is formed such thatthe side face of the opening is in a tapered shape having a wider widthtoward the upper side in the z direction that is perpendicular to thelight reception surface JS. In particular, each opening is formed byperforming an isotropic etching process.

[Sum Up]

As described above, in this embodiment, each of the first to third lensmaterial layers 121 b, 122 b, and 123 b configuring the inner-layer lens120 b is formed such that the side face thereof is a tapered face titledwith respect to the z direction that is perpendicular to the lightreception surface JS. In other words, the inner-layer lens 120 b isformed such that the side faces of the lens material layers 121 b, 122b, and 123 b are along the lens surfaces Lc and Ls shown in FIGS. 11 and12. Accordingly, scattering of the light incident to the inner-layerlens 120 b on the lens surface can be suppressed.

As a result, according to this embodiment, occurrence of a decrease inthe sensitivity due to scattering can be prevented, and thereby theimage quality of an image that is imaged can be improved.

3. Embodiment 3 [Configuration of Device and Others]

FIG. 15 and FIG. 16 are cross-sectional views representing majorportions of a solid-state imaging device 1 c according to Embodiment 3of the present invention. Here, FIG. 15, similarly to FIG. 4, shows aportion of the pixel P disposed in the center portion of the imageforming area PA represented in FIG. 2. On the other hand, FIG. 16,similarly to FIG. 5, shows a portion of the pixel P disposed in theperipheral portion of the image forming area PA represented in FIG. 2.

As shown in FIGS. 15 and 16, in this embodiment, an inner-layer lens 120c is different from that of Embodiment 1. Except for this point, thisembodiment is the same as Embodiment 1. Thus, description of portionscommon to Embodiment 1 is omitted here.

The inner-layer lens 120 c, as shown in FIGS. 15 and 16, similarly tothat of Embodiment 1, includes first to third lens material layers 121c, 122 c, and 123 c.

Although the first to third lens material layers 121 c, 122 c, and 123 chave the same shapes as those of Embodiment 1, the configuration ofoptical materials used for formation of the layers is different fromthat of Embodiment 1.

In this embodiment, the lens material layers 121 c, 122 c, and 123 c areformed to include portions of which the refractive indices decrease in adirection toward the photo diode 21. In other words, among a pluralityof the lens material layers 121 c, 122 c, and 123 c, the first lensmaterial layer 121 c disposed on the lowermost layer is formed by usingan optical material having the lowest refractive index. In addition,among the plurality of the lens material layers 121 c, 122 c, and 123 c,the third lens material layer 123 c disposed on the uppermost layer isformed by using an optical material having the highest refractive index.

For example, the first lens material layer 121 c is formed from SiONhaving a refractive index of 1.7. In addition, the second lens materiallayer 122 c, for example, is formed from SiON having a refractive indexof 1.85. The first lens material layer 121 c and the second lensmaterial layer 122 c are formed by differently adjusting the containingratios of [0] and [N] in using the CVD method. The third lens materiallayer 123 c, for example, is formed from SiN having a refractive indexof 2.0.

[Sum Up]

As described above, in this embodiment, the lens material layers 121 c,122 c, and 123 c configuring the inner-layer lens 120 c are formed tohave refractive indices decreasing in the direction toward the photodiode 21. In such a case, occurrence of reflection at the time of outputof light from the lower surface of the inner-layer lens 120 c can beprevented. Furthermore, in a case where the refractive index of theupper portion of the inner-layer lens 120 c is high, a differencebetween the refractive indices is decreased, thereby reflection from theupper end of the lens can be suppressed.

As a result, according to this embodiment, the sensitivity can beimproved, thereby the image quality of an image that is imaged can beimproved.

4. Embodiment 4 [Configuration of Device and Others]

FIG. 17 and FIG. 18 are cross-sectional views representing majorportions of a solid-state imaging device 1 d according to Embodiment 4of the present invention. Here, FIG. 17, similarly to FIG. 4, shows aportion of the pixel P disposed in the center portion of the imageforming area PA represented in FIG. 2. On the other hand, FIG. 18,similarly to FIG. 5, shows a portion of the pixel P disposed in theperipheral portion of the image forming area PA represented in FIG. 2.

As shown in FIGS. 17 and 18, in this embodiment, an inner-layer lens 120d is different from that of Embodiment 1. Except for this point, thisembodiment is the same as Embodiment 1. Thus, description of portionscommon to Embodiment 1 is omitted here.

The inner-layer lens 120 d, as shown in FIGS. 17 and 18, similarly tothat of Embodiment 1, includes first to third lens material layers 121d, 122 d, and 123 d.

Although the first to third lens material layers 121 d, 122 d, and 123 dhave the same shapes as those of Embodiment 1, the configuration ofoptical materials used for formation of the layers is different fromthat of Embodiment 1.

In this embodiment, the lens material layers 121 d, 122 d, and 123 d areformed to include portions of which the refractive indices increase in adirection toward the photo diode 21. In other words, among a pluralityof the lens material layers 121 d, 122 d, and 123 d, the first lensmaterial layer 121 d disposed on the lowermost layer is formed by usingan optical material having the highest refractive index. In addition,among the plurality of the lens material layers 121 d, 122 d, and 123 d,the third lens material layer 123 d disposed on the uppermost layer isformed by using an optical material having the lowest refractive index.

For example, the first lens material layer 121 d is formed from SiNhaving a refractive index of 2.0. In addition, the second lens materiallayer 122 d, for example, is formed from SiON having a refractive indexof 1.85. The third lens material layer 123 d, for example, is formedfrom SiON having a refractive index of 1.7. The second lens materiallayer 122 d and the third lens material layer 123 d are formed bydifferently adjusting the containing ratios of [O] and [N] in using theCVD method.

[Sum Up]

As described above, in this embodiment, the lens material layers 121 d,122 d, and 123 d configuring the inner-layer lens 120 d are formed tohave refractive indices increasing in the direction toward the photodiode 21. In such a case, the effective curvature of the lower surfaceof the inner-layer lens 120 d is increased, and accordingly, the beambending capability of this portion can be improved. Furthermore, in acase where the refractive index of the upper portion of the inner-layerlens 120 d is low, a difference between the refractive indices isdecreased, thereby reflection from the upper end of the lens can besuppressed.

As a result, according to this embodiment, the sensitivity can beimproved, thereby the image quality of an image that is imaged can beimproved.

5. Embodiment 5 [Configuration of Device and Others]

FIG. 19 and FIG. 20 are cross-sectional views representing majorportions of a solid-state imaging device 1 e according to Embodiment 5of the present invention. Here, FIG. 19, similarly to FIG. 4, shows aportion of the pixel P disposed in the center portion of the imageforming area PA represented in FIG. 2. On the other hand, FIG. 20,similarly to FIG. 5, shows a portion of the pixel P disposed in theperipheral portion of the image forming area PA represented in FIG. 2.

As shown in FIGS. 19 and 20, in this embodiment, an optical waveguide150 is disposed further. Except for this point, this embodiment is thesame as Embodiment 1. Thus, description of portions common to Embodiment1 is omitted here.

The optical waveguide 150, as shown in FIGS. 19 and 20, is formed to bepositioned on the photo diode 21 on the upper side of the surface of thesubstrate 101. The optical waveguide 150 is configured so as to guideincident light to the light reception surface JS of the photo diode 21.The optical waveguide 150, as shown in FIGS. 19 and 20, is interposedbetween the inner-layer lens 120 and the light reception surface JS ofthe photo diode 21 and is formed so as to guide the light output fromthe inner-layer lens 120 to the light reception surface JS of the photodiode 21.

In particular, on the surface of the substrate 101, as shown in FIGS. 20and 21, the wiring layer 110 is disposed. In the wiring layer 110, asdescribed above, wirings 110 h are disposed inside the insulating layer110 z, and the insulating layer 110 z is formed from alight-transmissive material through which light can be transmitted. Forexample, the insulating layer 110 z is formed from a silicon oxide film(refractive index n=1.43).

The optical waveguide 150, as shown in FIGS. 20 and 21, is disposed soas to extend to the light reception surface JS of the photo diode 21inside the wiring layer 110. The optical waveguide 150 is formed byusing an optical material that has a refractive index higher than thatof the insulating layer 110 z configuring the wiring layer 110. Forexample, the optical waveguide 150 is formed by using silicon nitride(refractive index: 2.0) that is deposited by using a plasma CDV method.In other words, the optical waveguide 150 is configured to serve as acore portion, and the insulating layer 110 z is configured to serve as aclad portion.

[Sum Up]

As described above, in this embodiment, the optical waveguide 150 isformed so as to guide the incident light to the light reception surfaceJS of the photo diode 21.

As a result, according to this embodiment, the sensitivity can beimproved, and thereby the image quality of an image that is imaged canbe improved.

6. Others

The present invention is not limited to the above-described embodiments,and various modified examples can be employed.

In the above-described embodiments, a case where the embodiments areapplied to a CMOS image sensor has been described. However, the presentinvention is not limited thereto. For example, the present invention canbe applied to a CCD image sensor.

In addition, the forming of the inner-layer lens is not limited to thatdescribed in the above-described embodiments.

FIGS. 21 and 22 are diagrams showing major portions of a solid-stateimaging device according to such an embodiment of the present invention.Here, FIG. 21, similarly to FIG. 5, shows a cross-section of a portionof the pixel P that is disposed in the peripheral portion of the imageforming area PA represented in FIG. 2. FIG. 22 is a plan view showingthe relationship between lens material layers 121 f, 122 f, and 123 fconfiguring an inner-layer lens 120 f and the photo diode 21 in theabove-described portion.

As shown in FIG. 21, the inner-layer lens 120 f, similarly to that ofEmbodiment 1, includes a first lens material layer 121 f, a second lensmaterial layer 122 f, and a third lens material layer 123 f. The layersare sequentially stacked. In addition, the lens material layers 121 f,122 f, and 123 f are disposed such that different levels are formed onthe side face aligned along the z direction perpendicular to the lightreception surface JS.

However, as shown in FIG. 21, the lens material layers 121 f, 122 f, and123 f are disposed so as to have the curvature of the lens surface Ls tobe larger than that of Embodiment 1.

In particular, as shown in FIG. 22, gaps between the side faces (theleft side in FIG. 22), which are located on the peripheral side of theimage forming area PA, of the lens material layers 121 f, 122 f, and 123f are formed to be less than those of Embodiment 1.

Accordingly, the curvature of the lens surface Ls of a half lens, whichis located on the peripheral side of the image forming area PA, of theinner-layer lens 120 f may be configured to be greater than that ofEmbodiment 1. When the curvature of the half lens is increased, the“beam bending effect” that refracts the main light beam H2 can beimproved further. As in Embodiment 1, in a case where the curvature ofthe half lens is less than that of the case shown in FIGS. 21 and 22,the main light beam H2 output from the on-chip lens 140 is preferablybound in a wide range. Accordingly, there is a margin for dimensionalvariations of the inter-layer lens. Therefore, the reliability and theyield ratio of the product can be improved.

FIGS. 23 and 24 are diagrams showing major portions of a solid-stateimaging device according to such an embodiment of the present invention.Here, FIG. 23, similarly to FIG. 5, shows a cross-section of a portionof the pixel P that is disposed in the peripheral portion of the imageforming area PA represented in FIG. 2. FIG. 24 is a plan view showingthe relationship between lens material layers 121 g, 122 g, and 123 gconfiguring an inner-layer lens 120 g and the photo diode 21 in theabove-described portion.

As shown in FIG. 23, the lens material layers 121 g, 122 g, and 123 gmay be disposed such that the curvature of the lens surface Ls is lessthan that of Embodiment 1.

In particular, as shown in FIG. 24, gaps between the side faces (theleft side in FIG. 24), which are located on the peripheral side of theimage forming area PA, of the lens material layers 121 g, 122 g, and 123g may be formed to be greater than those of Embodiment 1.

In other words, each of the layers may be formed to be shifted, so thatthe pitch of the first lens material layers 121 g of a lower layer islonger than that of the second lens material layers 122 g of a layerlocated on the upper side of the lower layer, and the pitch of the thirdlens material layers 123 g of a layer located on a further upper side islonger than that of the second lens material layers 122 g.

By decreasing the curvature of the lens surface Ls as described above,the lens area is widened, thereby the focus of the on-chip lens can beloosened. In addition, the design can be performed based on thedifference between the shift amounts in an easy manner.

In addition, in the above-described embodiments, a case where theinner-layer lens is formed by stacking three lens material layers hasbeen described. However, the present invention is not limited thereto.Thus, the inner-layer lens may be formed by stacking more than 3 lensmaterial layers. In addition, the inner-layer lens may be formed in onelayer.

In addition, in the above-described embodiments, a case where thepresent invention is applied to a camera has been described. However,the present invention is not limited thereto. Thus, the presentinvention can be applied to other electronic apparatuses such as ascanner and a copier that include a solid-state imaging device.

The solid-state imaging devices 1, 1 b, 1 c, 1 d, and 1 e of theabove-described embodiments correspond to a solid-state imaging deviceaccording to an embodiment of the present invention. The photo diode 21of the above-described embodiments corresponds to a photoelectricconversion unit according to an embodiment of the present invention. Inaddition, the camera 40 of the above-described embodiments correspondsto an electronic apparatus according to an embodiment of the presentinvention. The substrate 101 of the above-described embodimentscorresponds to a substrate according to an embodiment of the presentinvention. The inner-layer lenses 120, 120 b, 120 c, 120 d, and 120 e ofthe above-described embodiments correspond to an inner-layer lensaccording to an embodiment of the present invention. In addition, thefirst lens material layers 121, 121 b, 121 c, 121 d, and 121 e of theabove-described embodiments correspond to a lens material layer or afirst lens material layer according to an embodiment of the presentinvention. The second lens material layers 122, 122 b, 122 c, 122 d, and122 e of the above-described embodiments correspond to a lens materiallayer or a first lens material layer according to an embodiment of thepresent invention. In addition, the third lens material layers 123, 123b, 123 c, 123 d, and 123 e of the above-described embodiments correspondto a lens material layer or a second lens material layer according to anembodiment of the present invention. The color filter 130 of theabove-described embodiments corresponds to a color filter according toan embodiment of the present invention. In addition, the on-chip lens140 of the above-described embodiments corresponds to an on-chip lensaccording to an embodiment of the present invention. The opticalwaveguide 150 of the above-described embodiments corresponds to anoptical waveguide according to an embodiment of the present invention.In addition, the imaging surface PS and the image forming area PA of theabove-described embodiments correspond to an imaging surface accordingto an embodiment of the present invention.

It should be understood by those skilled in the art that variousmodifications, combinations, sub-combinations and alterations may occurdepending on design requirements and other factors insofar as they arewithin the scope of the appended claims or the equivalents thereof.

What is claimed is:
 1. A solid-state imaging device comprising: aplurality of photoelectric conversion units disposed on an imagingsurface of a substrate; and a plurality of inner-layer lenses that aredisposed in correspondence with each of the plurality of photoelectricconversion units on the upper side of the photoelectric conversion unitsand are formed in shapes protruding in directions toward thephotoelectric conversion units, wherein each of the plurality ofinner-layer lenses is formed to have different lens shapes in the centerand in the periphery of the imaging surface, wherein the center of eachof the plurality of inner-layer lenses is disposed so as to be shiftedfurther to the center side of the imaging surface with respect to thecenter of the photoelectric conversion unit as the position of the eachof the plurality of the inner-layer lenses disposed on the imagingsurface is more distant from the center of the imaging surface, whereinthe inner-layer lens is formed by stacking a plurality of lens materiallayers, wherein each of the plurality of lens material layers is formedsuch that a lower face of a first lens material layer that is theclosest to the photoelectric conversion unit of the plurality of lensmaterial layers has an area less than that of an upper face of a secondlens material layer that is the most distant from the photoelectricconversion unit of the plurality of lens material layers, and wherein across-section of each of the plurality of lens material layers that isperpendicular to the imaging surface includes a tapered portion of whicha width that is defined in a direction along the imaging surface isnarrowed further in a direction toward the photoelectric conversionunit.
 2. The solid-state imaging device according to claim 1, whereineach of the plurality of lens material layers is formed to have arefractive index decreasing in the direction toward the photoelectricconversion unit.
 3. The solid-state imaging device according to claim 1,wherein each of the plurality of lens material layers is formed to havea refractive index increasing in the direction toward the photoelectricconversion unit.
 4. A solid-state imaging device comprising: a pluralityof photoelectric conversion units disposed on an imaging surface of asubstrate; and a plurality of inner-layer lenses that are disposed incorrespondence with each of the plurality of photoelectric conversionunits on the upper side of the photoelectric conversion units and areformed in shapes protruding in directions toward the photoelectricconversion units, wherein each of the plurality of inner-layer lenses isformed to have different lens shapes in the center and in the peripheryof the imaging surface, wherein the center of each of the plurality ofinner-layer lenses is disposed so as to be shifted further to the centerside of the imaging surface with respect to the center of thephotoelectric conversion unit as the position of the each of theplurality of the inner-layer lenses disposed on the imaging surface ismore distant from the center of the imaging surface, wherein theinner-layer lens is formed by stacking a plurality of lens materiallayers, wherein each of the plurality of lens material layers is formedsuch that a lower face of a first lens material layer that is theclosest to the photoelectric conversion unit of the plurality of lensmaterial layers has an area less than that of an upper face of a secondlens material layer that is the most distant from the photoelectricconversion unit of the plurality of lens material layers, and whereineach of the plurality of lens material layers is formed to have arefractive index changing in the direction toward the photoelectricconversion unit.
 5. A solid-state imaging device comprising: a pluralityof photoelectric conversion units disposed on an imaging surface of asubstrate; optical waveguides disposed in correspondence with each ofthe plurality of photoelectric conversion units on the upper side of theplurality of photoelectric conversion units; and a plurality ofinner-layer lenses that are disposed in correspondence with each of theplurality of photoelectric conversion units on the upper side of thephotoelectric conversion units and are formed in shapes protruding indirections toward the photoelectric conversion units, wherein each ofthe plurality of inner-layer lenses is formed to have different lensshapes in the center and in the periphery of the imaging surface, andwherein each inner-layer lens is disposed so as to be interposed betweena respective one of the optical waveguides and a respective one of thephotoelectric conversion units.